EKO-ECO RATIONALIZATION IN PRINTED CIRCUIT BOARDS TECHNOLOGY DEVELOPMENT
Main researcher
: LIPNJAK, GORANA (25946) Assistants
DEVČIĆ-JERAS, ANA (157122)
ŽERJAV, VESNA (164085)
RAJHENBAH, DARKO (96883)
TADIĆ-ČOLIĆ, VIŠNJICA (48911)
KAFTANIĆ HADŽIĆ, VESNA (133000)
PURGARIĆ, BRANISLAV (39345)
Type of research: applied Duration from: 01/01/91. to 12/31/94. Papers on project (total): 76
Institution name: Ericsson - Nikola Tesla, Institut, Zagreb (71) Department/Institute: CHEMICAL TECHNOLOGY DEPARTMENT Address: KRAPINSKA 45 City: 10000 - Zagreb, Croatia
Communication
Phone: 385 (0)1 353-535 (4206)
Phone: 385 (0)1 354-206
Fax: 385 (0)1 328-540
Summary: The project refers to the improvement and rationalization
of particular segments of the technological process of manufacture of
precise printed circuit boards with plated-through holes, the aims of
which are quality improvement, material and energy cuts and acceptance of
ecological requirements. The researches deal with the application of
pulse current in electrolytic metal deposition processes, usage of water
soluble soldering fluxes and resists as well as precise polarography and
cyclic voltammetry analytic methods, with the application of modern
quality assurance methods based on the international ISO 9000 standards.
Research goals: The aim of the project is reduction of costs,
application of ecological materials in the production of PCBs and quality
improvement. The obtained research results enable the usage of
water-dilutable solder masks and photoresists, as well as the application
of ecologically suitable fluxes in soft soldering process. New copper and
gold electrodeposition methods, like pulse current metal deposition, and
optimal deposition parameters reduce the using up of metals and improve
the quality of metal coating. Careful study of new analytic methods and
the application of FMEA analysis (Failure Mode and Effect Analysis) yield
better PCB quality. Protective coating on soldering surfaces of printed
boards for surface mounting and the efficiency of imidazole derivates as
inhibitors of atmospheric corrosion of copper on printed boards were
tested. Good results were also obtained at determining ionic contamination
of printed boards and SMT assemblies. A direct metallizing process of
printed boards was developed which offers large economic and ecological
advantages.